SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To prevent resin from sticking on a lead by arranging a supporting member supporting a lead member at least on one side of the packages upper half or the packages lower half. CONSTITUTION:The leads 24 having a constitution each where they are extended outward along the upper surface of the packages lower half 26b and the part each along the upper surface of the packages lower half 26b of the lead 24 is exposed in the part 27 of a difference in level. Further, the packages lower half 26b has a built-in supporting member 30. This supporting member 30 is composed of a metal having an insulating property and high thermal conductivity. The supporting member 30 as a whole is of a cap shape having a bottomed rectangle shape composed of a bottom part 31, a supporting part 32 and a pillar part 33. Further, a plurality of through holes 34 are formed in the prescribed positions of the bottom part 31, the supporting part 32 and the pillar part 33. Thereby, distortion of the lead member at the time of resin molding can be prevented.