| 摘要 |
PURPOSE:To reduce the size of a metallic enclosure for housing a plurality of semiconductor chips by arranging a first semiconductor chip on an insulating substrate and a second semiconductor chip which is turned over as compared with the first semiconductor chip on the first semiconductor chip. CONSTITUTION:In a metallic package composed of an insulating substrate 1 and metallic enclosure 3, a first semiconductor chip 2a is mounted 1 in an inverted state on the substrate 1 by flip-chip bonding and a second semiconductor chip 2b is mounted on the chip 2a in a normal state so that the rear surfaces of the chips 2a and 3b can meet each other. The chip 2a is connected to wiring on the substrate 1 through bump electrodes 5 and the chip 2b is connected to the wiring on the substrate 1 through bonding wires 4. Therefore, the using area of the substrate 1 becomes the same as that obtained when only the chip 2a is mounted on the substrate 1 and the size of the metallic enclosure can be reduced. |
