发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM
摘要 PURPOSE:To provide a photosensitive resin composition and a photosensitive film without peeling between the photosensitive layer and a support even in the case of conveying the photosensitive laminate in an uncut state and storing it, and having superior various performances. CONSTITUTION:The photosensitive resin composition soluble or swellable in an aqueous solution of alkali comprising 3-20 pts.wt. of an ethylenically unsaturated compound represented by formula in which R<1> is H or methyl; R<2> is H or a 1-3C alkyl; R<3> is a 4-14C alkyl; n is an integer of 13-20; and m is 1, 2, or 3. (B) 15-40 pts.wt. of an ethylenically unsaturated compound other than (A), (C) 50-70 pts.wt. of a polymer having carboxylic groups, [the total content of (A), (B), and (C) is 100 pts.wt.], and (D) 0.05-20 pts.wt. of a photoinitiator, and the photosensitive film using this resin composition.
申请公布号 JPH0792673(A) 申请公布日期 1995.04.07
申请号 JP19930239794 申请日期 1993.09.27
申请人 HITACHI CHEM CO LTD 发明人 MINAMI YOSHITAKA;MIZOI TAKENORI
分类号 G03F7/004;G03F7/027;G03F7/031;G03F7/033;G03F7/038;H01L21/027;H05K3/00;(IPC1-7):G03F7/027 主分类号 G03F7/004
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