| 摘要 |
Silver-gold and silver-gold-tin alloys can be deposited at a high rate from electroplating baths which comprise, in addition to silver as dicyanoargentate, gold as dicyanoaurate and, if appropriate, tin as a soluble tin(II) compound, the potassium salt of gluconic acid, glucaric acid and/or glucuronic acid as complexing agent.
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| 申请人 |
W.C. HERAEUS GMBH, 63450 HANAU, DE |
发明人 |
HEMPEL, WOLFGANG, 61169 FRIEDBERG, DE;HERKLOTZ, GUENTER, DR., 63486 BRUCHKOEBEL, DE;FREY, THOMAS, 63454 HANAU, DE |
