发明名称 Verfahren und Vorrichtung zum Kontaktieren des Wicklungsdrahtes einer Spule mit einem Anschlußstift
摘要 In the case of the method, a specific amount of solder is initially applied to the connecting pin (4, 5) which is provided with the winding end. The solder can be applied, for example, by immersion of the pin end in a solder bath (11) at a relatively low temperature, or by melting a solder wire. Subsequently, the solder is melted, using a welding burner (13) under a barrier gas (protective gas), at the soft-soldering temperature. In this way, flux-free soldering is possible without the high thermal stress of welding. <IMAGE>
申请公布号 DE4336000(A1) 申请公布日期 1995.04.27
申请号 DE19934336000 申请日期 1993.10.21
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 HENDEL, HORST, DIPL.-ING. (FH), 12209 BERLIN, DE;VOJTA, ERICH, 91334 HEMHOFEN, DE
分类号 B23K1/00;H01F41/10;(IPC1-7):H01F41/10;H01R43/02;B23K26/00;B23K9/16;H01H49/00;B23K3/06 主分类号 B23K1/00
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