发明名称 |
Lid for semiconductor package and package having the lid |
摘要 |
In a ceramic lid for sealing a semiconductor device mount portion of a ceramic package substrate having a semiconductor device mounted thereon, a seal layer disposed in an outer peripheral edge portion of a lid is formed by a solder comprising 2 to 15 wt % of Bi, 2.0 to 6.0 wt % of Sn, 0.5 to 2.0 wt % of In, 0.5 to 2.0 wt % of Ag and the balance of Pb, through an Ag-Pt system underlying metallized layer. A semiconductor package comprising a semiconductor package substrate and a lid is sealed by the lid.
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申请公布号 |
US5414300(A) |
申请公布日期 |
1995.05.09 |
申请号 |
US19940301186 |
申请日期 |
1994.09.06 |
申请人 |
SUMITOMO METAL CERAMICS INC. |
发明人 |
TOZAWA, YOJI;HASHIMOTO, SHIZUKI;YAMAMOTO, TETSUYA |
分类号 |
H01L23/12;H01L23/02;H01L23/04;H01L23/10;(IPC1-7):H01L21/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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