| 摘要 |
<p>PURPOSE:To prevent the reliability of a semiconductor device from lowering even if a Cu lead frame allowing high speed operation higher than several hundreds MHz is employed. CONSTITUTION:The semiconductor device 11 has such structure as a semiconductor chip 12 is sealed in a ceramic enclosure, comprising a base part 13 and a sealing part 14, excellent in high speed operation, heat dissipation properties, and electric characteristics. A Cu lead frame 17 connected electrically with the semiconductor chip 12 is held between the base part 13 and the sealing part 14 and an anchor hole is made in the lead frame 17 at the part held by the base and sealing parts 13, 14. A glass based adhesive 16 is filled in the anchor hole between the lead frame 17 and the base and sealing parts 13, 14. This structure prevents the reliability of semiconductor device from lowering even when a Cu lead frame allowing high speed operation of several hundreds MHz or above is employed.</p> |
