Method and apparatus for thermal coefficient of expansion matched substrate attachment

摘要

A radio frequency apparatus desirably includes at least one microelectronic device comprising a substrate including the at least one microelectronic device and a package base for mounting the microelectronic device. The package base includes external interconnections coupled to internal interconnections and an adhesive affixing the substrate to the package base. The adhesive is disposed along a first axis of the substrate. The internal interconnections are coupled to the microelectronic device. A lid is sealed to the package base. The lid seals the microelectronic device.