| 摘要 |
PURPOSE:To enhance a multilayer printed wiring board in reliability by a method wherein a conductive circuit provided to it by plating is enhanced in adhesion to an insulating resin layer, and a short circuit is prevented from occurring in the conductive circuit. CONSTITUTION:A semi-cured first insulating resin layer 3 is formed on a board on which a circuit has been formed, and an uncured second insulating resin layer 4 is laminated thereon. Calcium carbonate fine powder 5 soluble in acid is sprinkled over the second insulating resin layer 4 to make the insulating resin layers 3 and 4 completely cured, then the surface of the second insulating resin layer 4 is polished to make the calcium carbonate fine powder 5 exposed. The calcium carbonate fine powder 5 is removed by acid treatment for the formation of recesses, and then the surface of the insulating resin layer 4 is roughened. A plating layer 7 is deposited on the surface of the layer 4 for the formation of a circuit. |
