WAFER PROCESSING DEVICE AND WAFER PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wafer processing device and a wafer processing method, capable of efficiently obtaining chips of stable quality.SOLUTION: A wafer processing device by which thickness of a wafer having a modified region formed inside by laser beams is thinly processed, includes: a grinding part which grinds the back surface of the wafer by a grinding wheel in a state where the surface of the wafer is vacuum-sucked and develops fine cracks extending from the modified region while removing the modified region; and a polishing part for polishing the back surface of the wafer to be a mirror surface using polishing cloth after grinding.SELECTED DRAWING: Figure 9