| 摘要 |
<p>PURPOSE:To simply check defective parts at cutting and splitting step by forming check marks for the precision criterion of cutting and splitting only near the cross points of each scribe line. CONSTITUTION:Semiconductor patterns are formed in each semiconductor circuit pattern forming region on the surface of a glass substrate, 1 and 4 check marks 6 are formed near the cross points 5 of scribe lines 4 and one for each of 4 corners of each circuit substrate and 80mum inside the scribe line 4 with aluminum of wiring material. A L shaped check marks 6 500mum long, 20mum wide is formed, and the substrate is cut along the scribe lines with a general method and split into individual semiconductor circuit substrate. As the check marks 6 are formed at each of 4 corners of the circuit substrate, the checking is easier and more efficient and a substrate is utilized more efficiently compared with the conventional product.</p> |
