发明名称 NEGATIVE TYPE PHOTOSENSITIVE ELECTRODEPOSITION COATING MATERIAL RESIN COMPOSITION AND ELECTRODEPOSITION COATING BATH USING THE SAME AND PRODUCTION OF RESIST PATTERN
摘要 PURPOSE:To obtain a photosensitive resin compsn. having an excellent release property and flexibility by incorporating a specific resin salt, a water insoluble photopolymerizable unsatd. compd. and a water insoluble photoinitiator into the compsn. CONSTITUTION:This photosensitive resin compsn. is prepd. by incorporating the resin salt formed by neutralizing a linear polymer compd. obtd. by copolymerizing >=5 pts.wt. monomer expressed by formula, 10 to 30 pts.wt. vinyl monomer contg. a carboxyl group and 0 to 85 pts.wt. other vinyl monomers at ratios at which the total amt. of the respective components attains 100 pts.wt., the water insoluble photopolymerizable unsatd. compd. and the water insoluble photoinitiator into the compsn. This electrodeposition coating bath is obtd. by using the compsn. A conductive base body is immersed as an anode into the electrodeposition coating bath and is subjected to electrodeposition by energization to form an electrodeposition coating film on the conductive base body. Next, the electrodeposition coating film is irradiated in an image form with active rays, by which the exposed parts are photoset and the unexposed parts are removed by development. In the formula, R<1> is a hydrogen atom, etc.; R<2> is an alkylene group; R<3> is an alkyl group; n is an integer from 1 to 23.
申请公布号 JPH07225479(A) 申请公布日期 1995.08.22
申请号 JP19940016507 申请日期 1994.02.10
申请人 HITACHI CHEM CO LTD 发明人 KATO TAKURO;TSUKADA KATSUSHIGE;SAWABE MASARU;TACHIKI SHIGEO
分类号 G03F7/027;C09D5/44;C25D13/06;G03F7/031;G03F7/033;H01L21/027;H05K3/00;(IPC1-7):G03F7/033 主分类号 G03F7/027
代理机构 代理人
主权项
地址