发明名称 LEAD FRAME AND MANUFACTURE OF SEMICONDUCTOR DEVICE EMPLOYING IT
摘要 PURPOSE:To realize compact sealing by arranging a through hole comprising a curl, i.e., an arcuate hole, and a gate contiguous in a holding frame thereby fusing and curing a resin under good state with no waste. CONSTITUTION:Lead frame units are arranged in two-stage through a holding frame 10. The part for fixing a support bar 17 to the holding frame is forked and a gate 20a of width W and length L is formed in the holding frame from the forked part. A through hole 20b comprising the gate 20a and a curl 20b, i.e., an arcuate hole having an arcuate edge of diameter phi1 larger than the width W, contiguous to the parallel edge of the gate is made. The lead frame is resin sealed using a metal mold having no curl nor gate.
申请公布号 JPH07240489(A) 申请公布日期 1995.09.12
申请号 JP19940031595 申请日期 1994.03.01
申请人 MITSUI HIGH TEC INC 发明人 MITSUI TAKAAKI;KAJIYAMA HITOSHI;SHIRAISHI ATSUSHI;HANADA HIDESHI
分类号 H01L23/28;H01L21/56;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/28
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