发明名称 RESIN COMPOSITION, PERMANENT RESIST RESIN COMPOSITION, AND THEIR CURED ITEM
摘要 PURPOSE:To obtain a resin compsn. useful for obtaining a printed circuit board which has a high resolution, is easily developed with a 1,1,1-trichloroethane-based org. solvent or an aq. alkali soln., is resistant to an org. solvent such as isopropyl alcohol and to a plating soln. in electroless plating, and also is resistant to soldering heat. CONSTITUTION:Both a resin compsn. and a permanent resist resin compsn. for a printed circuit board comprise a urethane acrylate or methacrylate compd. having at least one isocyanate group, an epoxy acrylate or methacrylate compd., a diluent comprising photopolymerizable and thermally reactive monomers, and a photopolymn. initiator.
申请公布号 JPH07247330(A) 申请公布日期 1995.09.26
申请号 JP19940040843 申请日期 1994.03.11
申请人 SUMITOMO BAKELITE CO LTD 发明人 HOZUMI TAKESHI
分类号 G03F7/027;C08F2/48;C08F20/32;C08F20/34;C08F220/32;C08F220/34;C08F290/00;C08F290/06;C08G18/67;C08G18/70;C08G18/72;G03F7/028;G03F7/40;H05K3/28;(IPC1-7):C08F290/06 主分类号 G03F7/027
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