| 摘要 |
PURPOSE:To make it possible to reduce the cost of a power semiconductor device, which is constituted by housing a power element and a control element in the same case, and to make it possible to enhance the reliability of the device. CONSTITUTION:For example, a power circuit part 12 to be mounted with a power element 12b is constituted on an insulated metal substrate 11. In the same way, a control circuit part 14 to be mounted with a control element 14b is constituted on a PCB 13. These circuit parts 12 and 14 are housed in the same case 15, which is formed by insert-molding a power terminal 16 and a signal terminal 17. After this, the connection of the element 12b with the terminal 16, the connection of the element 14b with the terminal 17 and the electrical connection between the substrates 11 and 13 are all executed by a wire bonding. |
