发明名称 THERMOSETTING RESIN MOLDING METHOD
摘要 PURPOSE:To shorten the molding and reduce the molding cycle by making differences between a plurality of cavities and thus controlling thermosetting resin after a lapse of a predetermined time to be uniform in its curing. CONSTITUTION:Respective four holes 38 for a heater are formed on a stationary side mold 30 and a movable side mold 45, a high temperature heater 47 and a high temperature thermocouple are disposed in two inside holes 38 and a high temperature heater 48 and a heating thermocouple are disposed in two outside holes 38. An area in the proximity of the central part of a mold 2 is made into a high temperature area A to be heated by the high temperature heater 47 for heating the inner cavity 1a at high temperature. Also, areas in the vicinity of both ends of the mold 2 are made into low temperature areas B lower than the high temperature area A, and are formed along the heater 48, then outer cavities 1b in the low temperature areas B are heated by a temperature lower than the inner cavity 1a. In this way, the curing time in a part of being late in its curing time is hastened so as to render the curing uniform.
申请公布号 JPH07276413(A) 申请公布日期 1995.10.24
申请号 JP19940077420 申请日期 1994.04.15
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 AZUMA KEIJI;MINEMATSU TAMOTSU;NOGUCHI KOJI;SUMITA YASUHIRO;HATTORI KAZUO
分类号 B29C45/26;B29C45/00;B29C45/32;B29C45/73;B29C45/78;B29K101/10;(IPC1-7):B29C45/00 主分类号 B29C45/26
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