发明名称 |
THERMOSETTING RESIN MOLDING METHOD |
摘要 |
PURPOSE:To shorten the molding and reduce the molding cycle by making differences between a plurality of cavities and thus controlling thermosetting resin after a lapse of a predetermined time to be uniform in its curing. CONSTITUTION:Respective four holes 38 for a heater are formed on a stationary side mold 30 and a movable side mold 45, a high temperature heater 47 and a high temperature thermocouple are disposed in two inside holes 38 and a high temperature heater 48 and a heating thermocouple are disposed in two outside holes 38. An area in the proximity of the central part of a mold 2 is made into a high temperature area A to be heated by the high temperature heater 47 for heating the inner cavity 1a at high temperature. Also, areas in the vicinity of both ends of the mold 2 are made into low temperature areas B lower than the high temperature area A, and are formed along the heater 48, then outer cavities 1b in the low temperature areas B are heated by a temperature lower than the inner cavity 1a. In this way, the curing time in a part of being late in its curing time is hastened so as to render the curing uniform. |
申请公布号 |
JPH07276413(A) |
申请公布日期 |
1995.10.24 |
申请号 |
JP19940077420 |
申请日期 |
1994.04.15 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
AZUMA KEIJI;MINEMATSU TAMOTSU;NOGUCHI KOJI;SUMITA YASUHIRO;HATTORI KAZUO |
分类号 |
B29C45/26;B29C45/00;B29C45/32;B29C45/73;B29C45/78;B29K101/10;(IPC1-7):B29C45/00 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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