Package carrier for semiconductor components

摘要

The package carrier (10) is comprised of several layers (12-15) of paper or wood material. The layers are shaped corresponding to the outer form of the semiconductor components (11). In one embodiments the layers are wholly comprised of paper, cardboard or wood and are stuck together by a biologically degradable adhesive. The layers may themselves form several cut-out and stuck-together layers of paper. The package carrier may comprise an upper part (12), an intermediate part (13), a base part (14) and a holder part (15).