摘要 |
<p>PURPOSE:To obtain a semiconductor device in which all terminals in the limited number can be utilized for signal input/output and for power supply and in which also a test circuit can be operated. CONSTITUTION:For example, separately from leads 14 to which electrode pads 12a for signal input/output and for power supply are connected, leads 16 for test only are prepared on a lead frame 11, and the leads 16 for test only are connected, via bonding wires 17, to pads 12b, for test only, on a semiconductor chip 12. Then, recessed parts 18 are formed in a lower package 13b. Thereby, the leads 16 for test only are constituted so as to be exposed to the outside from the rear of the resin package 13.</p> |