发明名称 POWER MODULE DEVICE
摘要 PURPOSE:To obtain a power module device which is lessened in size, easily assembled, manufactured at a low cost, and capable of preventing heat released from a power element as a heat releasing body from being conducted to a control element. CONSTITUTION:A power module device is equipped with a metal plate 11 composed of a flat 11a and a recess 11b and a circuit board 15 which spans the recess 11b, and a package is composed of the metal plate 11 and the circuit board 15. A power element 3 is mounted on the base of the recess 11b, a control element 4 is mounted on the underside of the circuit board 15, and the power element 3 and the control element 4 are electrically connected together through the intermediary of a wiring pattern 13 provided onto the metal plate 11 and others.
申请公布号 JPH07297575(A) 申请公布日期 1995.11.10
申请号 JP19940083485 申请日期 1994.04.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 KATO HAJIME
分类号 H05K7/14;H01L23/24;H01L23/433;H01L25/07;H01L25/10;H01L25/16;H01L25/18;H01L29/78;H05K1/00;H05K1/05;H05K1/14;H05K1/18;H05K3/00;H05K3/28;H05K5/00;H05K7/20;(IPC1-7):H05K7/14 主分类号 H05K7/14
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