| 摘要 |
<p>PURPOSE:To provide a semiconductor device packaging method and package thereof wherein the semiconductor device can be connected to a circuit board at a high productivity and high reliability. CONSTITUTION:Connecting electrodes 6 made of a thermoplastic resin setting type conductive material are formed on a specified area of a circuit board 4, a semiconductor device 1 is vacuum checked by a thermocompression bonding tool 7 to bringing bumps 3 of the device 1 into contact with connecting electrodes 6 of the circuit board 4, thereby thermocompression bonding them. Since the thermoplastic resin-setting type conductive material quickly hardening by cooling is used, the productivity is improved. Since the thermocompression bonding is made at a lower temp., the thermal stress caused by the thermal expansion coefficient difference between the semiconductor device and circuit board is little and the reliability is improved.</p> |
