| 摘要 |
<p>PURPOSE:To obtain a highly reliable lead frame and a semiconductor device utilizing the same which can connect an inner lead with high reliability with a circuit pattern of a fine lead pitch, does not refuse at the time when it is heated due to surface mounting to the substrate mounting the package, realizes multiple pin and never generates bridge between leads. CONSTITUTION:In a lead frame 7, a high melting point solder 8 is provided at the end part of an inner lead 1 formed around a semiconductor ship mounting region. Moreover, in the lead frame 7 and semiconductor device utilizing the same, the inner lead 1 providing the high melting point solder 8 at the end part of the lead is connected with a circuit parttern 10 formed at the external circumference of the chip mounting substrate 9 to form a composite frame with the substrate.</p> |
