发明名称 Method of forming local interconnect structure without P-N junction between active elements
摘要 An interconnect structure, and method for forming same, is suitable for use in integrated circuits such as SRAM devices. The structure uses masking of a polycrystalline silicon interconnect level to move a P-N junction to a region within a polycrystalline silicon interconnect line, rather than at the substrate. This P-N junction can then be shorted out using a refractory metal silicide formed on the polycrystalline silicon interconnect structure.
申请公布号 US5478771(A) 申请公布日期 1995.12.26
申请号 US19940359006 申请日期 1994.12.19
申请人 SGS-THOMSON MICROELECTRONICS, INC. 发明人 CHAN, TSIU C.;BRYANT, FRANK R.;WALTERS, JOHN L.
分类号 H01L21/768;H01L23/532;H01L27/11;(IPC1-7):H01L21/70 主分类号 H01L21/768
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