发明名称 TERMINAL ASSEMBLING STRUCTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a terminal assembling structure of a semiconductor device which can realize a high reliability and a low cost, and furthermore, can convert the pin alignment pitch of a connector terminal easily by making coinsident to the specification. CONSTITUTION:Outer lead-in terminals 3 for power circuit, and pin form connector terminals 4 for control signal are provided by aligning on the peripheral area of a terminal case 1, and the internal connecting ends 3b and 4b of the above terminals are connected to a power circuit and a control circuit assembled in the terminal case 1. In this semiconductor device, the pin form connector terminals 4 and guide pins 5 of connectors erected at both ends of the connector terminals 4 are formed integrally to a terminal block 6 which consists of a resin compact made as an independent part, the above terminal block 6 is installed to the fitting groove 1a of the terminal case 1 in an inserting type method, and it is fixed to a specified position through fitting claws 1b, in a removal preventive method.
申请公布号 JPH087956(A) 申请公布日期 1996.01.12
申请号 JP19940141607 申请日期 1994.06.23
申请人 FUJI ELECTRIC CO LTD 发明人 SOYANO SHIN;TOBA SUSUMU;MOMOSE SHINSUKE
分类号 H01R9/24;H01L25/07;H01L25/18;(IPC1-7):H01R9/24 主分类号 H01R9/24
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