| 摘要 |
PURPOSE:To prevent resin from flowing out without providing a tie bar to a lead frame by a method wherein resin is injected between all leads except four corners. CONSTITUTION:A semiconductor device is sealed in with resin through a resin molding method that resin is injected through a gate into a molding die where a lead frame mounted with a semiconductor chip is set, wherein resin is injected between all leads 1 except four corners. For instance, a gate which branches out into four parts for injecting resin between all the leads 1, a resin filling spot, and an air vent for removing air from a molding die when resin is injected are provided to a molding die. Resin is injected in first through a gate out of four gates located furthest from the air vent by a control device to move air inside the molding die toward the air vent to remove air through the air vent. Then, after a certain span of time elapses, resin is injected through the other gates to fill a resin filling spot for molding so as not to protrude between the leads 1. |
