SEMICONDUCTOR CHIP WITH ON-CHIP GROUND PLANE

摘要

PURPOSE: To manufacture a semiconductor chip without adding any manufacturing process or cost for the manufacture of a chip itself by reducing a parasitic signal while a device is operating. CONSTITUTION: A semiconductor chip with an on-chip ground plane has a low- resistivity semiconductor region 202 in a plurality of non-device regions of the chip and a reach-through region 204 that is electrically connected to the low-resistivity semiconductor region. At least one surface side contact 206 is used to electrically connect the reach-through region and the low-resistivity semiconductor region to the ground potential and to ground the on-chip ground plane electrically.