发明名称 Method of and apparatus for placing blocks in semiconductor integrated circuit
摘要 A method of and an apparatus for placing blocks in a semiconductor integrated circuit determined the placement of a plurality of blocks having different sizes. An externally contacting frame is set for the plurality of blocks initially placed in such a manner as to eliminate overlapping between the blocks. The blocks are moved by compressing the externally contacting frame by a predetermined length in a first direction, and the blocks in which overlapping has consequently occurred are moved, or deformed without changing their areas. Further, the blocks are moved by compressing the externally contacting frame by a predetermined length in a second direction perpendicular to the first direction, and the blocks in which overlapping has consequently occurred are moved, or deformed without changing their areas. The compression is repeated in the two directions until a target size is obtained.
申请公布号 US5493510(A) 申请公布日期 1996.02.20
申请号 US19930148519 申请日期 1993.11.08
申请人 KAWASAKI STEEL CORPORATION 发明人 SHIKATA, HIROMI
分类号 G06F17/50;(IPC1-7):G06F17/50 主分类号 G06F17/50
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