发明名称 |
METHOD AND SYSTEM FOR ETCHING |
摘要 |
PURPOSE: To protect the mask characteristics against deterioration due to active gas intruding from the end part of a mask. CONSTITUTION: A reaction chamber 1 is provided with a port 1a for introducing an active gas and a port 1b for discharging the gas produced through reaction by means of an exhaust pump. A supporting base 2 is disposed in the reaction chamber 1 and a rod 4 for supporting a substrate 3 to be processed is disposed on the supporting base 2. A rod 6 for securing a mask p.late piece 5 having desired shape with a polysilicon film being deposited on the surface thereof is disposed above the supporting rod 4. The gas introduction port 1a is coupled with one end of a transportation pipe 7 having the other end coupled with a quartz discharge tube 8 covered with a microwave applicator 9. The microwave applicator 9 has a port 9a for introducingμ-wave from aμ-wave source and the quartz discharge tube 8 is provided, at the other end thereof, with a gas supply port 8a. This structure protect the mask characteristics from deteriorating due to active gas intruding from the end part of a mask.
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申请公布号 |
JPH0869993(A) |
申请公布日期 |
1996.03.12 |
申请号 |
JP19940203956 |
申请日期 |
1994.08.29 |
申请人 |
TOSHIBA CORP |
发明人 |
MORI HARUKI;SHIMOMURA KOJI;YOSHIDA YUKIMASA |
分类号 |
C23F4/00;H01L21/302;H01L21/306;H01L21/3065;H01L21/311;H01L21/3213;(IPC1-7):H01L21/306 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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