| 摘要 |
PURPOSE: To eliminate such an unsatisfactory state as to say that lead fames are entangled with each other or are deformed even in the case where the fellow lead frames, which are stacked when the lead frames are fed to an automatic semiconductor chip mounter, are deviated from each other and to provide the lead frames, which can be separated from each other one sheet by one sheet. CONSTITUTION: The width of a holding part 4 is made wider than the intervals between inner leads 2 adjacent to the part 4 and the holding part 4. Even if the lead frames, which are stacked when these lead frames are fed to an automatic semiconductor chip mounter, are deviated from each other, the holding part 4 of the upper side lead frame does never intrude into the gaps between the holding part 4 of the lower side lead frame and the inner leads 2 because the width of the holding part 4 of each lead frame is wider than the intervals between the leads 2 adjacent to the part 4 and the holding 4 and the entanglement of the lead frames and the deformation of the lead frames are not generated. |
