| 摘要 |
PURPOSE: To ensure the quality and the surface mounting performance by providing the pressure receiving surface of setting a projection in which the contact part of a contact pin is made to bite into a spherical bump and a quantity to be made to bite to increase the reliability of contact and minimize the damage of the bump. CONSTITUTION: When an IC package main body 1 is pushed down, a spherical bump 2 is pushed between the pressure receiving plates 5a, 5b of a contact pin 4 and projections 5e, 5f are made to bite into the spherical surface by elasticity of elastic supporting pieces 4a, 4b. When the biting progresses the pressure receiving plates 5c, 5d abut on the spherical surface, the biting is suppressed and the damage of the spherical surface can be minimized except a bottom dead center fused to a wiring pattern at the time of being mounted on a printed circuit board. The contact of high reliability is ensured by cooperation of the projection and the pressure receiving surface properly set and at the same time the trace of a bump surface is minimized, thereby being able to prevent the damage of the value of a commodity. |
