Verfahren zum Montieren von Bauteilen und Vorrichtung dafür.

摘要

The present invention refers to a method for mounting a component at a specific position, preferably on a substrate such as a printed circuit board, by means of attracting the components through an attracting nozzle from a component supply unit transferring the component and mounting same at the desired position. Such a method is improved in that the component, after being attracted through the attracting nozzle, is preliminarily rotated by a certain angle about a vertical axis of the attracting nozzle while being raised through said attracting nozzle in the direction of a vertical Z-axis. Moreover, the invention refers to an apparatus wherein the attracting nozzle is rotatably supported about its vertical centre axis through a moveable mounting head unit with a projection width of the component being detected through an optical detecting means to determine mounting position correcting amounts.