HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE: To improve reliability, on the occasion of obtaining a multilayer substrate by bonding an insulating substrate on a metal substrate, by controlling influence of semiconductor elements and parts of both substrates as much as possible and by preventing warpage and peeling between both substrates due to difference of temperature coefficient. CONSTITUTION: A metal fine lead 43 is provided at a bonding pad 41 provided in the periphery of a second substrate 38 and at a bonding pad of a lower layer substrate 30 and this metal fine lead is used to lift the second substrate 38.