Vorrichtung und Verfahren zur Herstellung von Halbleitereinrichtungen.

摘要

The present invention discloses a semiconductor manufacturing apparatus comprising a wafers supply unit including a tray on which a plurality of wafers are placed, a positioning unit for detecting specific points on the wafers prior to molding of a resin and compensating for the position of the wafers, a molding unit for molding the resin on the peripheries of the wafers which have been compensated for position, an injecting unit for supplying the resin to the molding unit, a storage unit for storing resin-molded wafers, a wafer carrying unit for carrying wafers between the supply unit and the positioning unit, between the positioning unit and the molding unit and between the molding unit and the storage unit, and a control unit for controlling the operation of the supply unit, the positioning unit, the molding unit, the injecting unit, the storage unit and the carrying unit.