发明名称 |
Combination and method for coupling a heat sink to a semiconductor device |
摘要 |
A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink, and means of fastening the heat sink to the device. To enable securement of the heat sink on the device without any external fastening arrangement having to be used, and without unduly straining the solder spot of the device pins to a printed circuit, the device is provided with undercut regions on opposite sides adjacent to the exposed surface of the plate for releasable engagement by the fastening means.
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申请公布号 |
US5521439(A) |
申请公布日期 |
1996.05.28 |
申请号 |
US19940222282 |
申请日期 |
1994.04.05 |
申请人 |
SGS-MICROELECTRONICS S.R.L. |
发明人 |
CASATI, PAOLO;MARCHISI, GIUSEPPE |
分类号 |
H01L23/40;H01L23/433;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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