| 摘要 |
<p>An integrated circuit device in which an element mounted on a substrate is fixed on a heat sink, is provided with a ceramic substrate having a circuit conductor theron and used to mount an element thereon, and a metal case covering the ceramic substrate and provided with a contact plate for pressing the circuit conductor. Part of the metal case is bent so as to press the ceramic substrate to the heat sink via a non-conductive resin. The contact plate of the metal case is in contact with the circuit conductor to make the level of electric potential of the metal case equal to that of the circuit conductor.</p> |
