| 摘要 |
PURPOSE: To provide a semiconductor package excellent in electric property while avoiding the cost up accompanying the multilayering, etc., of a high- density wiring layer. CONSTITUTION: This semiconductor package 11 is constituted by mounting a heat sink 12 on the base unit 25 having an i/o terminal 29. There is an electronic parts mounting area for mounting an LSI chip 19, etc., as electronic parts, in the high-density wiring layer B of the heat sink 12. A plurality of connector terminals 22 are made at the margin of the electronic parts mounting region. A plurality of bonding pads 30 are made on the side of a base unit 25, too. The bonding pad 30 and the connector terminal 22 are electrically connected with each other through a bonding wire, and the same section is sealed with sealing resin 36. A printed wiring board 30 constituting the base unit 25 is a multilayer board which has at least three or more conductor layers, and the two layers out of the conductor layer are a ground layer and a power source layer. |
