| 摘要 |
A semiconductor device (1B) is provided with a lead frame (2) having an opening (11) at a central part thereof and a plurality of leads which are respectively made up of an inner lead (2a) and an outer lead (2b), a radiator block (3) provided under the opening (11) of the lead frame (2) and having a top surface part and a bottom part, where a gap is formed between the top surface part of the radiator block (3) and the lead frame (2), a semiconductor chip (5) mounted on the top surface part of the radiator block (3), a plurality of wires (6) bonding the semiconductor chip (5) and the leads, and a package (7) which encapsulates at least a part of the radiator block (3), the semiconductor chip (5), the wires (6) and the inner leads (2a) of the leads so that the outer leads (2b) extend outwardly of the package (7). The package (7) fills the gap between the top surface part of the radiator block (3) and the lead frame (2), and the bottom part of the radiator block (3) projects from the package (7) by a predetermined length to conduct heat generated from the semiconductor chip (5) outside the package (7). <IMAGE> |
