RADIATION SENSITIVE RESIN COMPOSITION, ITS FILM AND PATTERN FORMING METHOD

摘要

PURPOSE: To provide a novel resin compsn. having sensitivity to radiation in itself and capable of forming a silicon oxide film without exposing a body to be worked to a high temp. or causing cracking even when the compsn. is formed in a thick film shape. CONSTITUTION: A soln. is prepd. by dissolving 190g poly(di-t-butoxysiloxane) and 8.25g (0.02mol) triphenylsulfonium triflate as an acid generating agent in 237g methyl isobutyl ketone as a solvent and 26g diethylene glycol as a high b.p. solvent. The soln. is filtered with a membrane filter having 0.2μm pore size to obtain the objective radiation senstiive resin compsn.