| 摘要 |
PURPOSE: To obtain high heat resistance and dimensional stability and heighten adhesive strength between a thermoplastic aromatic polyimide layer and an aromatic polyimide film by integrally laminating the thermoplastic aromatic polyimide layer having a low logarithmic viscosity number on at least one face of the aromatic polyimide film having high heat resistance. CONSTITUTION: A multilayer aromatic polyimide film 1 is formed by integrally laminating, for example, a thin film 3 consisting of a thermoplastic aromatic polyimide on at least one face of a base body layer 2 consisting of an aromatic polyimide having high heat resistance. The multilayer aromatic polyimide film is coated with an organic polar solvent solution of an aromatic polyimide precursor having a dehydrating agent and a catalyst. Thereafter, it is heated so as to form a layer 3 of an aromatic polyimide solution which is of an imide of the aromatic polyimide precursor on one face of the base body layer 2. The obtained laminated matter is dried preferably at 50-200 deg.C, and treated with heat at 300 deg.C or higher so as to evaporate the solvent and make the imide for manufacturing the film. |
