发明名称 HIGH SPEED AND HIGH DENSITY SRAM CELL
摘要 PROBLEM TO BE SOLVED: To improve the productivity of an SRAM and, furthermore, improve the operation life and operation reliability of a memory by a method, wherein respective n-channel TFTs are directly connected to related P-channel transistors to constitute inverters and the respective inverters are directly connected to each other through nodes between the transistors. SOLUTION: A problem, which is caused by high kinetic energy electrons in the transistors of a conventional SRAM and known as hot carrier aging, does not exist in the P-channel pull-downs of n-channel MOS devices 10 and 12 and in access transistors 14-17. As the n-channel TFT load devices 10 and 12 are made of polysilicon which has a smaller order of an electron mobility than that of single-crystal silicon, the probability of damages to the TFT unit caused by the high kinetic energy is low. As a result, the long term stability and reliability of a memory such as an SRAM can be improved.
申请公布号 JPH08227943(A) 申请公布日期 1996.09.03
申请号 JP19950271660 申请日期 1995.10.20
申请人 AT & T CORP 发明人 KUOOFUA RII;CHIYUNNTEIN RIU
分类号 G11C11/412;H01L21/8242;H01L21/8244;H01L27/108;H01L27/11;(IPC1-7):H01L21/824;H01L21/824 主分类号 G11C11/412
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