发明名称 CERAMIC PACKAGE AND MANUFACTURE THEREOF
摘要 <p>PURPOSE: To mount a ceramic package surely and reliably on a board by relaxing thermal stress with respect to the package body at the time of mounting. CONSTITUTION: A part for forming a land pattern 24 is recessed and a laminate 20 of ceramic green sheet, provided with a land pattern 24 to be connected electrically with an inner wiring pattern 22, is formed on the inner bottom face of the recess. After firing the laminate 20, the recess 26 is filled with a brazing maternal 32 which us then bonded with an external connection terminal 34.</p>
申请公布号 JPH08236657(A) 申请公布日期 1996.09.13
申请号 JP19950033518 申请日期 1995.02.22
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KOSHI TAKAO
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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