| 摘要 |
<p>PURPOSE: To eliminate a need of a resin sealing operation by a transfer molding operation by a method wherein a hole part in a ring-shaped insulator which comes into contact with the connecting part between an outer lead and an inner lead is formed in such a way that its inside is faced with the inner lead and the hole part is made to be larger than a semiconductor chip to be mounted. CONSTITUTION: A lead frame 21 has a ring-shaped insulator 20 in contact with connections A between outer leads 1,... and inner leads 2,.... The insulator 20 is composed of an insulating material such as a ceramic, a rigid resin, a glass, specifically alumina, beryllia, an epoxy resin or the like. The insulator has a surface that is coincident with a plane which includes the connections A between the outer leads 1,... and the inner leads 2,.... The insulator 20 is arranged in such a way that tip parts of the inner leads 2,... are faced with the inside of a hole part 20b, the hole part 20b is larger by a prescribed size than a semiconductor chip to be mounted, and it is deeper to a prescribed extent than the semiconductor chip is thick.</p> |
