| 摘要 |
PURPOSE: To surely align solder balls and mount them on packages by sucking and aligning solder balls supplied from above in an array on a table and inverting them, dropping solder balls stored in an upper side of a table, transferring them to a supply container and collecting overflown excess balls. CONSTITUTION: Solder balls B stored in a supply container 41 are supplied to an alignment table 25 properly and are aligned in an array on the alignment table 25. Excess solder balls overflow from the alignment table 25 and are received by a collection container 42 and are transferred to the supply container 41 from the collection container 42 by a transfer means 43. Meanwhile, the alignment table 25 sucking aligned solder balls is inverted by an inversion mechanism 21 and solder balls are mounted on a printed board while they are aligned. Solder balls are supplied from the supply container 41 to the alignment table 25 by dropping and excess solder balls are received by the collection container 42 in a lower side of the alignment table 25. Therefore, a supply/ collection system can be made by a simple structure. |
