EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: To obtain the subject composition, excellent in not only heat resistance but also flame retardance and high reliability and useful for semiconductor devices by blending a curing agent having a specific structure and increasing the amount of a filter and reducing the amount converted of a Br compound or an Sb compound. CONSTITUTION: This resin composition consists essentially of (A) an epoxy resin, (B) a curing agent containing a compound simultaneously having structures of formulas I to III (R is H or a 1-4C alkyl) and (C) a filler in an amount of 87-95wt.% based on the whole composition. The respective amounts of a Br compound and an Sb compound are <=0.3wt.% based on the whole composition. Furthermore. the component (A) preferably contains a biphenyl type epoxy resin of formula IV (R<1> to R<8> are each H, a halogen or a 1-4C alkyl) as an essential component and the component (C) preferably contains >=50wt.% amorphous silica comprising 99-50wt.% spherical amorphous silica having 5-30μm average grain diameter and l-50wt.% spherical amorphous silica having <=3μm average grain diameter.