ADHESIVE TAPE FOR ELECTRONIC COMPONENT

摘要

PURPOSE: To obtain an adhesive tape desirable in the production of semiconductor devices by laying semi-cured adhesive layers which have different degrees of curing and each of which comprises a specified-group-containing butadiene/ acrylonitrile copolymer and a specified maleimide compound on a release tape. CONSTITUTION: At least two semi-cured layers which have different degrees of curing and each of which is prepared by making a liquid adhesive comprising a piperazinylethylaminocarbonyl-containing butadiene/acrylonitrile copolymer (a) having a weight-average molecular weight of 1000-50000 and an acrylonitrile content of 5-50wt.% and represented by formula I (wherein m=50-95; and n=5-50) and 10-900 pts.wt., per 100 pts.wt. (a), compound (b) having at least two maleimide groups (e.g. a compound of formula II) and curing this adhesive to stage B are laid on either surface of a release film. It is desirable that the at least two layers have specified slip rates. This tape does not suffer from e.g. a problem that the end of a lead frame penetrates the adhesive layer when used in the production of semiconductor devices.