发明名称 DEVICE AND METHOD FOR FIXING SUBSTRATE
摘要 <p>PURPOSE: To provide a device and method for securing a substrate by which a substrate can be sucked to a substrate placing stage with less suction errors. CONSTITUTION: A substrate securing device is provided with a substrate placing stage 10 on which a substrate 20 is placed, a plurality of suction holes which are provided to the stage 10, and suck and secure the substrate 20 by suction, and pressure members 12 and 14 which are counterposed to the stage 10 on the opposite side of the substrate 20. In a substrate securing method, the substrate is pressed by means of the pressing members 12 and 14 and sucked by the suction holes after the substrate 20 is placed on the stage 10 by using the substrate securing device constituted in the above-mentioned way.</p>
申请公布号 JPH08274148(A) 申请公布日期 1996.10.18
申请号 JP19950129010 申请日期 1995.04.28
申请人 SONY CORP 发明人 NAGANO YASUNORI;SUZUKI KIMIO
分类号 G02F1/1333;B23Q3/08;G09F9/00;H01L21/68;H01L21/683;(IPC1-7):H01L21/68;G02F1/133 主分类号 G02F1/1333
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