发明名称 INORGANIC LIGHTWEIGHT MOLDING
摘要 PURPOSE: To obtain a lightweight molding having flexibility by using a cement, a wood chip cement, slate waste powder, etc., and an inorganic compound such as silas balloon, etc., as raw materials. CONSTITUTION: This inorganic lightweight molding comprises a composition consisting of an inorganic compound, a water-soluble polymer compound having 10-300MPa tensile strength of a coating film, 30-65mN/m surface tension in 0.4wt.% aqueous solution at 20 deg.C and containing two or more hydroxy groups in one molecule, a water-soluble polymer compound containing one or more carboxyl groups or sulfone groups in one molecule and/or an anionic surfactant and a polymer compound having 0.1-10MPa tensile strength of a coating film, 200-2,000% elongation at break, -40 to 30 deg.C second-order transition temperature and 30-200cal/cc cohesive energy, contains >=50wt.% of the inorganic compound and has <=0.4g/cm<3> apparent density.
申请公布号 JPH08302059(A) 申请公布日期 1996.11.19
申请号 JP19950107548 申请日期 1995.05.01
申请人 TSUYATSUKU KK;IMOTO SABURO 发明人 HAYASHI TAKUJI;TAKEUCHI YASUHEI;IMOTO SABURO
分类号 C08J9/30;C04B14/02;C04B26/02;C08J9/32;(IPC1-7):C08J9/30 主分类号 C08J9/30
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