| 摘要 |
PURPOSE: To obtain a radiation-sensitive resin composition having the developability with an alkali developing solution, a sufficient resolution in a film thickness of 20μm or above, an excellent resistance to a plating solution, a good adhesion to a substrate, a good wettability with a plating solution in development, the capability of forming a good bump by plating, and an improved releasability of the curing agent from the substrate. CONSTITUTION: This composition comprises an alkali-soluble copolymer (A) composed of 10-50wt.% structural component derived from free radical- polymerizable carboxylic compound, 20-60wt.% structural component derived from a free radical-polymerizable carboxyl-free cycloalkane compound and 5-40wt.% structural component derived from other free radical-polymerizable compounds, a compound (B) having at least one ethylenic unsaturation, and a radiation-induced free radical polymerization initiator (C).
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