HEAT RESISTANT PHOTORESIST COMPOSITION, PHOTOSENSITIVE BASE MATERIAL AND NEGATIVE PATTERN FORMING METHOD

摘要

PURPOSE: To ensure superior sensitivity and resolution by blending specified polycarbodiimide with a compd. capable of giving an acidic compd. when irradiated with active light. CONSTITUTION: This heat resistant photoresist compsn. contains a resin component having carbodiimido units represented by the formula in each molecule and a compd. capable of giving an acidic compd. when irradiated with active light as essential components. In the formula, R is a divalent org. group. The compd. capable of giving an acidic compd. is arom. sulfonic ester or its deriv. A photosensitive layer formed using this photoresist compsn. is heated after irradiation with active light through a photomask and the unexposed part is removed with a developer. The carbodiimido unit content of the resin component is 20-100mol%, preferably 50-95mol%.