| 摘要 |
<p>PURPOSE: To increase the efficiency of a light receiving element which detects light through a slit-like opening without increasing a chip area of the semiconductor light receiving element while using a conventional light receiving chip. CONSTITUTION: A rectangular light receiving semiconductor chip 23 is bonded on a die pad of a lead frame which has a lead section 21, 22 and a die pad section 26. The semiconductor chip 23 is wire-bonded to the lead section. The semiconductor chip 23 is coated with resin which has a transparency for light to be detected. In this semiconductor light receiving element, the semiconductor chip is so mounted that its one side may be slant against the extending direction of the lead section.</p> |
