发明名称 BOILING COOLING DEVICE
摘要 PURPOSE: To lessen a thermosynphon-type boiling cooling device in size by a method wherein a heat receiving fin and a heat dissipating fin are joined together in a state that they are fused to a boiling/cooling tube which serves as a coolant tank. CONSTITUTION: A boiling cooling device 1 is equipped with boiling cooling tubes 3 filled with coolant of fluorocarbon and heat transfer fins 6 fixed to the outside of the boiling cooling tubes 3. The heat transfer fin 6 is composed of a heat receiving fin 6a interposed between the adjacent coolant tanks 3a of the boiling cooling tubes 3 and a heat dissipating fin 6b interposed between the adjacent condensation sections 3b of the boiling cooling tubes 3. The heat transfer fin 6 is formed through such a method that a thin plate of metal such as aluminum excellent in heat transfer properties is bent in a zigzag into a corrugated fin and brazed to the flat outer wall of the boiling/cooling fin. That is, the outer wall of the boiling/cooling tube 3 and the heat transfer fin 6 are bonded together in a state that they are fused to each other.
申请公布号 JPH08340189(A) 申请公布日期 1996.12.24
申请号 JP19950332145 申请日期 1995.12.20
申请人 NIPPONDENSO CO LTD 发明人 SUZUKI MASAHIKO;KAWAGUCHI SEIJI;KADOTA SHIGERU
分类号 F28D15/02;H01L23/427;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 F28D15/02
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